Phylum:Ascomycota >> Class: Ascomycetes >>  Order: Sordariales 
   
 
 BCRC Number NO BCRC Number!  
   
 Scientific Name: Scortechinia chaetomioides
 
   
   
 Author:

Scortechinia chaetomioides (Penz. & Sacc.) Arx & Müller, Beitr. Krypt.-fl. Schweiz 11 (1): 381. 1954.

Basionym: Enchnoa chaetomioides Penz. & Sacc., Malpighia 11(4):390. 1897.

   
 
 
 
 
 Description: Subiculum superficial, effuse, composed of dark brown, septate, thick-walled, dichotomous branched, apically blunt, 5-6 μm hyphae. Stromata extending subepidermally beneath subiculum and attaching to the base of ascomata. Ascomata erumpent from epidermis with remanants of raised epidermis around base of ascoma, immersed in subiculum, densely gregarious, subglobose to turbinate, 250-310 μm wide, 230-350 high, sometimes becoming cupulate or not, non-ostiolate, rarely with pale brown, 3-4 μm wide hairs around ascoma. Quellkörper composed of mucilaginous, hyaline, thick-walled cells with a narrow lumen, extending downwards from the apex, dome-shaped at first and then longitudinally elongated toward the middle centrum and nearly extending to the ascdi. Hymenium hyaline, crescent in section. Peridium 16-20 μm wide, composed of 4-6-layers of thick-walled, dark brown cells, with Munk pores between cell walls of the peridium; base of peridium usually wider, 18-40 μm wide, of 6-12-layers of cells. Asci 6-8 μm wide, 20-30 μm long in ascospore-containing portion, elliptic-clavate, unitunicate, without any apical apparatus, 6-8-spored, stipitate, stipe slender, easily broken, up to 50 μm long. Ascospores 5-8 × 2-4 μm, oblong to reniform, straight to curved, 1-celled, guttulate, hyaline, smooth, overlapping biseriate in the upper portion of ascus and uniseriate below.
 
 
 
 
 
 Specimens:

Taiwan, Taichung Hsien, Tungmaoshan, 29 Jan. 1996, NCHUPP-2440.

 
 
 
 Habitat: On dead branches of trees.
 
 
 
 Distribution:

Africa, India, Java, Taiwan.

 
 
 
 References:

Chen, CY and Hsieh, WH. 1997; Subramanian, CV and Sekar, G. 1990.

   
   
   
 Provided:

W. H. Hsieh

 
 
 Note: null